IEEE Intersociety Thermal and Thermomechanical Conference
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2018 IEEE 68th Electronic Components and Technology Conference. Sheraton San Diego Hotel and Marina. San Diego, CA May 29 - June 1, 2018. ECTC is sponsored by the IEEE Electronics Packaging Society. 68th ECTC Call for Papers.
Materials, Compounds, Adhesives, Substrates. Developing a Thetajc Standard Under Steady-State Testing Conditions. Use of the Monte Carlo Method in Packaging Thermal Calculations. Beat the Heat in 3D Chip Stacks with Embedded Cooling. Parida, Mark Schultz and Timothy Chainer J.
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IEEE Intersociety Thermal and Thermomechanical ConferenceDESCRIPTION
IEEE-ITherm conference is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.CONTENT
This web site ieee-itherm.net states the following, "IEEE Intersociety Thermal and Thermomechanical Conference." We noticed that the website said " ITherm 2017 Student Poster and Networking Session." It also said " The Intersociety Conference on Thermal and. Thermomechanical Phenomena in Electronic Systems. May 30 - June 2, 2017. 2017 Walt Disney World Swan and Dolphin Resort, Orlando, United States. Please download the Full Advance Program. We invite you to register for ITherm 2017. You may register on our Cvent websit." The header had IEEE-ITherm as the highest ranking optimized keyword. It is followed by IEEE ITherm conference, Call for Papers, and Abstract submission which isn't as ranked as highly as IEEE-ITherm. The next words ieee-itherm.net used was IEEE ITherm 2017. International conferences was included but could not be viewed by search engines.VIEW SIMILAR WEBSITES
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